Materials Science In Semiconductor Processing

杂志介绍

Materials Science In Semiconductor Processing杂志介绍

《Materials Science In Semiconductor Processing》是一本以English为主的未开放获取国际优秀期刊，中文名称半导体加工中的材料科学，本刊主要出版、报道工程技术-ENGINEERING, ELECTRICAL & ELECTRONIC领域的研究动态以及在该领域取得的各方面的经验和科研成果，介绍该领域有关本专业的最新进展，探讨行业发展的思路和方法，以促进学术信息交流，提高行业发展。该刊已被国际权威数据库SCIE收录，为该领域相关学科的发展起到了良好的推动作用，也得到了本专业人员的广泛认可。该刊最新影响因子为4.2，最新CiteScore 指数为8。

本刊近期中国学者发表的论文主要有：

• V2O5 nanobelts via a facile water-assisted strategy boosting electrochromic performance

  Author: Sun, Haohao; Wang, Wenxuan; Fan, Qiongzhen; Qi, Yanyuan; Xiong, Yuli; Jian, Zelang; Chen, Wen

• Ag/Ag3PO4 nanoparticles assembled on sepiolite nanofibers: Enhanced visible-light-driven photocatalysis and the important role of Ag decoration

  Author: Ren, Xiaofei; Hu, Guicong; Guo, Qingbin; Gao, Dengzheng; Wang, Li; Hu, Xiaolong

• Exploring the effect of oxygen environment on the Mo/CdTe/CdSe solar cell substrate configuration

  Author: Yang, Xiutao; Long, Yuchen; Zheng, Yujie; Wang, Jiayi; Zhou, Biao; Xie, Shenghui; Li, Bing; Zhang, Jingquan; Hao, Xia; Karazhanov, Smagul; Zeng, Guanggen; Feng, Lianghuan

• Slag refining at various viscosity conditions for SiC inclusion removal during Si scraps recycling

  Author: Pan, Di; Jiang, Dachuan; Hu, Zhiqiang; Li, Pengting; Tan, Yi; Li, Jin; Li, Jiayan

英文介绍

Materials Science In Semiconductor Processing杂志英文介绍

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.