International Journal Of Computer Integrated Manufacturing

杂志介绍

International Journal Of Computer Integrated Manufacturing杂志介绍

《International Journal Of Computer Integrated Manufacturing》是一本以English为主的未开放获取国际优秀期刊，中文名称国际计算机集成制造杂志，本刊主要出版、报道工程技术-COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS领域的研究动态以及在该领域取得的各方面的经验和科研成果，介绍该领域有关本专业的最新进展，探讨行业发展的思路和方法，以促进学术信息交流，提高行业发展。该刊已被国际权威数据库SCIE收录，为该领域相关学科的发展起到了良好的推动作用，也得到了本专业人员的广泛认可。该刊最新影响因子为3.7，最新CiteScore 指数为9。

本刊近期中国学者发表的论文主要有：

• A novel graph neural networks approach for 3D product model retrieval

  Author: Jian, Chengfeng; Lu, Yiqiang; Lin, Mingliang; Zhang, Meiyu

• A digital twin-based multi-objective optimization method for technical schemes in process industry

  Author: Zhu, Xiaoyang; Ji, Yangjian

• Design of intelligent manufacturing system based on digital twin for smart shop floors

  Author: Sun, Mengke; Cai, Zongyan; Zhao, Ningning

• Machine learning in the prediction of formability in aluminum hot stamping process with multiple variable blank holder force

  Author: Lu, Wei; Xiao, Wenchao; Li, Yong; Zheng, Kailun; Wu, Yong

英文介绍

International Journal Of Computer Integrated Manufacturing杂志英文介绍

International Journal of Computer Integrated Manufacturing (IJCIM) reports new research in theory and applications of computer integrated manufacturing. The scope spans mechanical and manufacturing engineering, software and computer engineering as well as automation and control engineering with a particular focus on today’s data driven manufacturing. Terms such as industry 4.0, intelligent manufacturing, digital manufacturing and cyber-physical manufacturing systems are now used to identify the area of knowledge that IJCIM has supported and shaped in its history of more than 30 years.

IJCIM continues to grow and has become a key forum for academics and industrial researchers to exchange information and ideas. In response to this interest, IJCIM is now published monthly, enabling the editors to target topical special issues; topics as diverse as digital twins, transdisciplinary engineering, cloud manufacturing, deep learning for manufacturing, service-oriented architectures, dematerialized manufacturing systems, wireless manufacturing and digital enterprise technologies to name a few.